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Title:
BLISTER PACK AND RESIN COMPOSITION FOR BLISTER PACK
Document Type and Number:
Japanese Patent JP2010083531
Kind Code:
A
Abstract:

To provide a blister pack which is excellent in thermoforming characteristics in processing, in low-temperature heat-sealing characteristics, in blocking resistance, and in printing characteristics even if the blister pack is made primarily of a lactic acid based polymer.

The blister pack includes a pasteboard, and a container made of the lactic acid system polymer. The pasteboard includes a substrate made of the lactic acid system polymer, on at least one surface side of which a heat-sensitive adhesive layer is provided. At least either one of the substrate and the container is substantially made of an unstretched sheet. The heat-sensitive adhesive layer meets all the following conditions (1)-(3): (1) the heat-sensitive adhesive layer is made of a resin composition including at least one of copolymer selected from an ethylene-vinyl acetate copolymer, an ethylene-ethyl acrylate copolymer and an ethylene-methyl methacrylate copolymer, and lubricant as essential components; (2) the Vicat softening temperature of the resin composition is 30-50C; and (3) the lubricant content of the resin composition is 3,000-6,000 ppm.


Inventors:
KANEMITSU HIROKI
SHIKAKURA YOSHIKAZU
YAMADA MASAO
Application Number:
JP2008254275A
Publication Date:
April 15, 2010
Filing Date:
September 30, 2008
Export Citation:
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Assignee:
FUJI SEAL INT INC
International Classes:
B65D75/36; B32B27/28; B32B27/36; C09J11/06; C09J123/08; C09J131/04; C09J133/06
Domestic Patent References:
JP2007136783A2007-06-07
Attorney, Agent or Firm:
Yukihisa Goto