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Patent Searching and Data


Title:
BLISTER PACK
Document Type and Number:
Japanese Patent JP2002370770
Kind Code:
A
Abstract:

To prevent a mount and a cover from directly coming into contact with an objective article for packaging while the packaging process is avoided from becoming complicated, and the packaging cost is avoided from increasing, for a blister pack.

This blister pack 10 has an article housing section 18 between the mount 12 and the cover 14. The mount 12 has a mount main surface 28, and a first supporting surface 30 which is raised in the article housing section 18 from the mount main surface 28, on the surface. The cover 14 has a cover main surface 32, and a second supporting surface 34 on the surface. In this case, the cover main surface 32 is arranged in a manner to be substantially confronted with the mount main surface 28. The second supporting surface 34 is raised in the article housing section 18 from the cover main surface 32, and is arranged at a location corresponding with the first supporting surface 30. The first supporting surface 30 and the second supporting surface 34 form gaps 38 and 40 between a tape roll 24 and the mount main surface 28 and the cover main surface 32 within the article housing section 18 by cooperating with each other. At the same time, the tape roll 24 is supported at a location to keep those gaps 38 and 40.


Inventors:
RYU HIDETAKA
NAKADATE TEIJI
Application Number:
JP2001183799A
Publication Date:
December 24, 2002
Filing Date:
June 18, 2001
Export Citation:
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Assignee:
THREE M INNOVATIVE PROPERTIES
International Classes:
B65D75/36; (IPC1-7): B65D75/36
Domestic Patent References:
JPH03162263A1991-07-12
JPH10273164A1998-10-13
Attorney, Agent or Firm:
Takashi Ishida (3 others)