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Patent Searching and Data


Title:
BLOCK COPOLYMER COMPOSITION AND HEAT SHRINKABLE FILM FOR PACKAGING
Document Type and Number:
Japanese Patent JP2011157512
Kind Code:
A
Abstract:

To provide a molding material for a packaging film which is formed of a specific block copolymer resin composition and has excellent heat shrinking property, tear break resistance, and transparency; and a heat shrinkable film for packaging.

The heat shrinkable film for packaging is formed of the block copolymer resin composition. In the block copolymer resin composition, which is a copolymer of a vinyl aromatic hydrocarbon and a conjugated diene, a mass ratio of the vinyl aromatic hydrocarbon to the conjugated diene is 80/20 to 60/40, a weight-average molecular weight is 50,000-200,000, and at least one loss tangent peak is obtained at -30°C or lower in the dynamic viscoelasticity measurement. In the heat shrinkable film for packaging, a longitudinal shrinkage percentage at 120°C is 20% or more, tear strength is 50 N/mm or more, a break displacement is 10 mm or more, and the haze degree is less than 10%.


Inventors:
SATO EIJI
ITO KATSUMI
OISHI MASAYUKI
Application Number:
JP2010021695A
Publication Date:
August 18, 2011
Filing Date:
February 03, 2010
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
C08L53/02; B32B7/02; B32B27/00; B32B27/32; B65D65/02; B65D65/40; B65D71/08; C08J5/18; C08L25/02; C08L51/04