PURPOSE: To enable the direct formation of hologram relief patterns on a block material of an irregular shape, such as cylindrical, columnar or lump shape, by thermocompression bonding a synthetic resin film or sheet provided with the hologram relief patterns onto a transparent or translucent thermoplastic synthetic resin block material by pressing its pattern surfaces thereto, then peeling the film or sheet.

CONSTITUTION: The hologram relief patterns are formed by embossing with rollers of an embossing device on the synthetic resin film as sheet 1, such as polyester. This film or sheet 1 is pressed to the surface 4 of the block material 3 desired to be formed with the hologram relief patterns and is thermocompression bonded by a hot plate 5 or hot roll. The block material 3 consists of the transparent or translucent thermoplastic synthetic resin and has the cylindrical, columnar, lumpy or planar shape. The surface 4 to be formed with the hologram relief patterns is required to be smooth without having ruggedness. The film or sheet 1 is removed from the block material 3 after the thermocompression bonding.