Title:
AROMATIC POLYAMIDE RESIN AND ITS RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3222192
Kind Code:
B2
Abstract:
PURPOSE: To obtain a composition useful as parts of medical equipments electrical and electronic parts, etc., having excellent heat resistance, dimensional stability and mechanical characteristics and improved processability and low water absorption by subjecting a specific diamine and an aromatic dicarboxylic acid to polycondensation in an organic solvent.
CONSTITUTION: An aromatic polyamide of formula I (X is ≤20C condensed polycyclic aromatic group or group of formula II; Y is direct bond, O, S, etc.; R is 1-4C alkyl or halogen; a is 0-2; b is 0-4; n is 1-1,000). The aromatic polyamide is obtained by subjecting 1,3-bis(3-aminophenoxy)benzene or 1,4-bis(4- aminophenoxy)benzene of formula III and an aromatic dicarboxylic acid dihalide to polycondensation in the presence of a dehydrohalogenating agent in an organic solvent at ≤60°C reaction temperature or by subjecting the benzene of formula III and an aromatic dicarboxylic acid to polycondensation in the presence of a condensation agent in an organic solvent at 10-150°C reaction temperature. Preferably the aromatic polyamide of formula I may be further blended with glass fibers and aromatic polyamide fibers.
Inventors:
Toshiyuki Kataoka
Nobufumi Koga
Hideaki Oikawa
Akihiro Yamaguchi
Nobufumi Koga
Hideaki Oikawa
Akihiro Yamaguchi
Application Number:
JP12053692A
Publication Date:
October 22, 2001
Filing Date:
May 13, 1992
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08G69/32; C08K7/02; C08L77/00; C08L77/10; (IPC1-7): C08G69/32; C08K7/02; C08L77/10
Domestic Patent References:
| JP62177020A | ||||
| JP62177022A | ||||
| JP62177023A | ||||
| JP6392716A | ||||
| JP5418922A | ||||
| JP63165515A | ||||
| JP61254662A | ||||
| JP3231965A |
Attorney, Agent or Firm:
Nobuyuki Kaneda (2 others)