Title:
基板組付構造及び基板組付方法
Document Type and Number:
Japanese Patent JP6684636
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate assembly structure and a process for assembling substrate, capable of positioning a substrate while ensuring assemblability of the substrate.SOLUTION: In an insertion recess part 60, a supporting point 70 which becomes a turning fulcrum is formed when turning a circuit board 50 between a tilted attitude 50Y and a standing posture 50X, and an inclination part 72 is formed on a bottom side opposite to the supporting point 70. In the case where the inclination part 72 supports a bottom end part side of the circuit board 50 and turns the circuit board 50 with the supporting point 70 as turning fulcrum, an inclination of the inclination part 72 is set so that a tip of a terminal 52 is maintained at a height position of a terminal insertion part 26C. In the insertion recess part 60, an upper side vertical supporting surface 66 that is contacted to a surface of a front surface 50A of the circuit board 50 of the standing posture 50X and a lower side vertical supporting surface 68 that is contacted to the surface of a back surface 50B of the circuit board 50 of the standing posture 50X are formed.SELECTED DRAWING: Figure 5
Inventors:
Yu Fujisaki
Shigeki Yoshida
Shigeki Yoshida
Application Number:
JP2016082267A
Publication Date:
April 22, 2020
Filing Date:
April 15, 2016
Export Citation:
Assignee:
Tokai Rika Electric Co., Ltd.
International Classes:
H05K7/14; B60R1/074
Domestic Patent References:
| JP2013067278A | ||||
| JP62037988U | ||||
| JP59099914A | ||||
| JP2007336044A |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda