Title:
BOARD FOR CHIP MOUNTING
Document Type and Number:
Japanese Patent JPH06140729
Kind Code:
A
Abstract:
PURPOSE: To simply and surely prevent sealing compound from spreading over the unnecessary part, and improve productivity.
CONSTITUTION: In a board P for chip mounting provided with a chip mounting part P1 wherein a chip B to be sealed by using slime state sealing compound A is mounted, a reserving trench P2 is formed so as to surround the chip mounting part, and superfluous sealing compound is stored in the reserving trench. Thereby the sealing compound can be prevented from spreading over the unnecessary part.
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Inventors:
ONARI KUNIHIRO
Application Number:
JP29050792A
Publication Date:
May 20, 1994
Filing Date:
October 28, 1992
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H01L23/28; H05K1/02; H05K1/18; (IPC1-7): H05K1/02; H01L23/28; H05K1/18
Attorney, Agent or Firm:
Mikio Kawase (1 person outside)