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Title:
BOARD CONVEYING METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP2008116072
Kind Code:
A
Abstract:

To provide a conveying method and a conveying device capable of conveying a board without cracking, and easily removing an unnecessary board in a conveying pathway from the conveying pathway.

This board conveying device comprises heating/cooling means every roller 1, and a surface temperature of the roller is controlled to satisfy |Trmax-Tmin|100C and |Tmax-Trmin|100C in carrying, where a surface maximum temperature of the board 2 is represented by Tmax, a surface minimum temperature by Tmin, a surface maximum temperature of the board 2 and the roller 1 just before arrival of the board 2 by Trmax, and its surface minimum temperature by Trmin. When the unnecessary board exists in the conveying pathway, the roller surface temperature is controlled to satisfy |Trmax-Tmin|100C and |Tmax-Trmin|100 C, and the unnecessary board is crushed during conveyance, and removed from the conveying pathway.


Inventors:
HORIKAWA AKIHIRO
NISHIKI NAOMI
MATSUDA NAOKO
NAKA HIROYUKI
Application Number:
JP2006297405A
Publication Date:
May 22, 2008
Filing Date:
November 01, 2006
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
F27B9/24; F27B9/36; F27B9/40; F27D19/00; H01J9/46
Domestic Patent References:
JPH0411394U1992-01-30
JPS51119605A1976-10-20
JP2004296773A2004-10-21
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano



 
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