Title:
基板切断装置および基板切断方法
Document Type and Number:
Japanese Patent JP7045126
Kind Code:
B2
Abstract:
A substrate cutting device includes: a first cutter including a plurality of first rotary blades; a second cutter including a plurality of second rotary blades; a first rotation drive unit for rotationally driving the first cutter; a second rotation drive unit for rotationally driving the second cutter; a cutter support unit; and a phase adjustment unit. The cutter support unit supports the first cutter and the second cutter such that the first and second cutters are radially opposed to each other so that rotation axes thereof are parallel to each other. The phase adjustment unit adjusts a phase of at least one of the first cutter and the second cutter such that each of the second rotary blades is located between two adjacent first rotary blades in an opposing area in which the first cutter and the second cutter are opposed to each other.
Inventors:
Tetsuya Shimamura
Hyakki Kazuhiro
Hyakki Kazuhiro
Application Number:
JP2015006405A
Publication Date:
March 31, 2022
Filing Date:
January 16, 2015
Export Citation:
Assignee:
Shoda Tektron Co., Ltd.
International Classes:
B23C3/30; B23C1/04; H05K3/00
Domestic Patent References:
| JP57121493A | ||||
| JP2109630A | ||||
| JP1153213A | ||||
| JP54038143U |
Attorney, Agent or Firm:
Hiroyuki Ito