Title:
基板設計支援装置、基板設計支援方法、及び基板設計支援プログラム
Document Type and Number:
Japanese Patent JP4481761
Kind Code:
B2
Abstract:
A board design aiding apparatus that simplifies a designed printed wiring board to predict a displacement quantity of the printed wiring board includes a layer thickness calculation section 21 for obtaining a mean thickness of an area of a board by a prescribed rule for an essential material forming a layer at each layer for constructing the printed wiring board, and a laminate model forming section 22 for forming a simple laminate model by laminating layers having layer thickness calculated by the layer thickness calculation section 21.
Inventors:
Kenji Fukuzono
Hideaki Yoshimura
Hideaki Yoshimura
Application Number:
JP2004234101A
Publication Date:
June 16, 2010
Filing Date:
August 11, 2004
Export Citation:
Assignee:
富士通株式会社
International Classes:
G06F17/50; H05K3/00
Other References:
尾田十八、外1名,多層ばり理論によるプリント基板の応力・変形の評価,日本機械学会論文集,日本,日本機械学会,1993年 7月,第59巻,第563号,第203-208頁
Attorney, Agent or Firm:
Hideo Akazawa
Hisako Ishido
Hisako Ishido