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Title:
BOARD FOR FLEXIBLE PRINTED CIRCUIT AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH04359585
Kind Code:
A
Abstract:

PURPOSE: To prevent damage of a surface of a polyimide film by forming the film of four layers of a protective plastic film, the polyimide film, a thermosetting adhesive layer and a metal foil.

CONSTITUTION: After both side surfaces of a polyimide film and one side surface of a protective plastic film are activated by a low temperature plasma of inorganic gas, the activated surfaces of the polyimide film and the plastic film are thermally press-bonded. Then, after the other activated surface of the polyimide film is coated with heat-curing agent, a metal foil is press-bonded to be laminated. Thus, contact with rolls in a later circuit forming step, etc., wear, scratch, pressing damage, etc., at the time of handling, and damage of the surface of the polyimide film can be prevented.


Inventors:
ARAI HITOSHI
SAKAGUCHI SANETERU
EIKUCHI KICHIJI
Application Number:
JP16203691A
Publication Date:
December 11, 1992
Filing Date:
June 06, 1991
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
B32B15/08; H05K1/03; H05K3/38; (IPC1-7): B32B15/08; H05K1/03; H05K3/38
Attorney, Agent or Firm:
Ryoichi Yamamoto (1 person outside)



 
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