Title:
BOARD INSPECTING METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP3863664
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To easily detect a failure inside a multilayered board.
SOLUTION: The first electrode 4, a reference board 3, the second electrode 5, a testing board 2 and the third electrode 6 are layered in order in the condition that the substrate 2 is opposed to the board 3 symmetrically, a propagation characteristic of an RF electromagnetic wave from the electrode 5 to the electrode 4 is measured as a reference characteristic by a network analyzer 7, a propagation characteristic of an RF electromagnetic wave from the electrode 5 to the electrode 6 is measured as a testing characteristic, and the measured reference characteristic is compared with the measured testing characteristic to determine the quality of the board 2.
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Inventors:
Masao Watanabe
Application Number:
JP16702498A
Publication Date:
December 27, 2006
Filing Date:
June 15, 1998
Export Citation:
Assignee:
Advantest Corporation
International Classes:
G01R31/02; G01N22/00; H05K3/00; H05K3/46; (IPC1-7): G01R31/02; G01N22/00; H05K3/00; H05K3/46
Domestic Patent References:
| JP10073425A | ||||
| JP48045279A | ||||
| JP8278342A |
Foreign References:
| US4634963 |
Attorney, Agent or Firm:
Nobuyuki Kaneda
Ishibashi Masayuki
Katsuhiro Ito
Ishibashi Masayuki
Katsuhiro Ito