To surely and smoothly move a substrate to an alignment position in a substrate examining device.

The substrate examining device 1 comprises a substrate position alignment mechanism 2 for aligning the substrate 3 to a specific examination position. The substrate position alignment mechanism 2 comprises a contact part 2a kept into point-contact with a side face 3a of the substrate 3, and a supporting pressing part 2c for rotating and supporting the contact part 2a and pressing the same to a specific direction. The substrate position alignment mechanism 2 rotates the contact part 2a when the contact part 2a is brought into contact with the side face 3a of the substrate 3 by rotating and supporting the contact part 2a to eliminate the displacement between the side face 3a of the substrate 3 and the contact part 2a caused by the contact, and to prevent the generation of biting. When the contact part 2a is moved to a substrate side face 3a side by the supporting pressing part 2c in this condition, the contact part 2a presses the substrate side face 3a in the specific direction while rotated along the substrate side face 3a to align the substrate to the specific examination position.

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