Title:
基板検査方法、基板検査システム及び制御装置
Document Type and Number:
Japanese Patent JP7220625
Kind Code:
B2
Abstract:
A method of inspecting a substrate, includes: creating a model indicating a relation between a pixel value in a captured image of the substrate and a feature amount of a film on the substrate, based on a measured feature amount of a film on a creating substrate and a captured image generated by imaging the creating substrate by an apparatus in a first system; imaging an object substrate by an apparatus in a second system to generate a captured image, and calculating an estimated feature amount of a film on the object substrate, based on the captured image and the model; calculating a statistical value of the estimated feature amounts of the object substrates; and calculating an offset amount for the estimated feature amount from a measured feature amount of a film formed by performing a same treatment on an offset substrate in the second system and the statistical value.
Inventors:
▲鶴▼田 豊久
Hiro Tomita
Hiro Tomita
Application Number:
JP2019105557A
Publication Date:
February 10, 2023
Filing Date:
June 05, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G01B11/06; G01B11/02; G01B11/30; H01L21/66
Domestic Patent References:
| JP2008209295A | ||||
| JP2010107355A | ||||
| JP201025575A | ||||
| JP2015215193A |
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine