Title:
BOARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2007027527
Kind Code:
A
Abstract:
To provide a board which can increase the positional accuracy of an electronic component fixed to the main body of the board and can make the board thin, and also to provide a method for manufacturing the board.
The board has a body 11, a recess 21 formed on the board body 11 and nearly corresponding in size to the outer shape of a capacitor component 13, the capacitor component 13 positioned on the recess 21, and notches 22 formed in the board body 11 forming side surfaces of the recess 21.
Inventors:
KOBAYASHI TOSHIO
ARAI SUNAO
MIYASHITA HITOSHI
IIZUKA HAJIME
ARAI SUNAO
MIYASHITA HITOSHI
IIZUKA HAJIME
Application Number:
JP2005209509A
Publication Date:
February 01, 2007
Filing Date:
July 20, 2005
Export Citation:
Assignee:
SHINKO ELECTRIC IND CO
International Classes:
H01L23/12; H01L25/00
Attorney, Agent or Firm:
Tadahiko Ito