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Title:
BOARD MATERIAL FOR BUILDING AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2001328107
Kind Code:
A
Abstract:

To provide a board material for building which is high in strength and good in dimensional stability.

In a core layer of a board, a mixture of a wafer and/or a strand and a woody fiber bundle is used as a reinforcing material of a hydraulic inorganic material. An additional amount of the wafer and/or the strand is controlled to ≤5 wt.% in the core layer by addition of the woody fiber bundle, a dimensional stability is improved without lowering a strength, and a formability is improved. In order to obtain a sharp irregular pattern by securing a surface smoothness, a mixed raw material wherein cement based raw material of 30-60 wt.%, silicic acid-containing material of 30-60 wt.%, perlite of 0-15 wt.%, and flake and/or wood flour and/or fiber of 5-25 wt.% are mixed, is used.


Inventors:
AKIE TAKASHIGE
Application Number:
JP2000151785A
Publication Date:
November 27, 2001
Filing Date:
May 23, 2000
Export Citation:
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Assignee:
NICHIHA KK
International Classes:
B27N3/00; B27N3/18; B32B13/02; E04C2/26; E04C2/30; (IPC1-7): B27N3/00; B27N3/18; B32B13/02; E04C2/26; E04C2/30
Attorney, Agent or Firm:
Tadao Usami