Title:
電解コンデンサの基板実装用コネクタおよび電子回路機器
Document Type and Number:
Japanese Patent JP5339531
Kind Code:
B2
Inventors:
Yuji Hamaoka
Akira Ohno
Akira Ohno
Application Number:
JP2009265956A
Publication Date:
November 13, 2013
Filing Date:
November 24, 2009
Export Citation:
Assignee:
Japan Aviation Electronics Industry Co., Ltd.
International Classes:
H01R13/66; H01R24/50; H01R33/05
Domestic Patent References:
| JP5652875U | ||||
| JP9186421A | ||||
| JP5949378U | ||||
| JP10335013A | ||||
| JP2002170640A | ||||
| JP2008244033A | ||||
| JP63157180U |
Foreign References:
| WO2008047571A1 |
Attorney, Agent or Firm:
Kenho Ikeda
Shuichi Fukuda
Takashi Sasaki
Shuichi Fukuda
Takashi Sasaki