BOARD MOUNTING DESIGNING DEVICE - Matsushita Electric Industrial Co., Ltd

Title:

BOARD MOUNTING DESIGNING DEVICE

Document Type and Number:

Japanese Patent JP3760150

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a board mounting designing device of high working efficiency capable of performing the mounting and designing of a printed board and a high-density board in parallel without distinguishing them in the layout of parts and the designing of wiring to a circuit board having a structure where the high-density board is mounted on the printed board.
SOLUTION: This device is composed of a main board setting part 121A for setting a main board, a sub-board setting part 121B for mounting a sub- board on the main board, a parts mounting part 122 for mounting the parts on each board, a wiring part 123 for mounting a wiring path on each board, and the like. The created mounting design data is transmitted to a display device 160 by a mounting data displaying controlling part 150A, and the shapes and the positional relationship of the boards, the parts and the wiring path are displayed as they are designed.

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Inventors:

Tsuchida Masayuki
Uemura Hirokazu
Nishikawa Yukinobu
Shinji Miura

Application Number:

JP2002313244A

Publication Date:

March 29, 2006

Filing Date:

March 20, 1995

Export Citation:

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