Title:
基板処理装置および基板有無確認方法
Document Type and Number:
Japanese Patent JP6723055
Kind Code:
B2
Abstract:
A substrate processing apparatus includes transport mechanisms 121a to 127a, a sensor 40 for detecting whether a wafer W is held by the transport mechanisms 121a to 127a, a sensor controller 82 for controlling the sensor 40, a position information acquiring part 81 for acquiring position information of the substrate W in the transport passage, a detection result acquiring part 83 for acquiring a detection result from the sensor 40, and a determination processor 84 for determining whether the detection result of the sensor and the position information are consistent with each other. When it is determined that the detection result of the sensor 40 is inconsistent with the position information, the sensor controller 82 makes the sensor 40 retry to detect whether the substrate W is held.
Inventors:
Tomohiro Tanaka
Kenichiro Saito
Takeda Koichi
Nishijima Masumi
Ryuichi Kosuga
Kenichiro Saito
Takeda Koichi
Nishijima Masumi
Ryuichi Kosuga
Application Number:
JP2016074951A
Publication Date:
July 15, 2020
Filing Date:
April 04, 2016
Export Citation:
Assignee:
Ebara Corporation
International Classes:
H01L21/677; B24B51/00; B65G49/07; H01L21/02; H01L21/304
Domestic Patent References:
| JP2011061008A | ||||
| JP2013030747A | ||||
| JP2009135433A | ||||
| JP2010182823A | ||||
| JP2004319961A |
Attorney, Agent or Firm:
Seiji Ohno
Kobayashi Hideyoshi
Hiroyuki Ohno
Koji Morita
Osamu Tsuda
Matsuno Chihiro
Seiichi Sakitani
Tsukuda Seigen
Hiroshi Nomoto
Kobayashi Hideyoshi
Hiroyuki Ohno
Koji Morita
Osamu Tsuda
Matsuno Chihiro
Seiichi Sakitani
Tsukuda Seigen
Hiroshi Nomoto