Title:
基板処理装置
Document Type and Number:
Japanese Patent JP4426036
Kind Code:
B2
Abstract:
This substrate processing device is identical to a wafer cleaning device 5 for cleaning a wafer W, which includes a supply nozzle 34 for supplying APM and the pure water, a spin chuck 31 for carrying the wafer W and a container 31 for accommodating the spin chuck 31. The container 30 includes an inner processing chamber 42 and an outer processing chamber 43 and is constructed so as to be movable up and down to the spin chuck 31. A first drainage line 50 is connected to the inner processing chamber 42 to discharge APM and the interior atmosphere, while a second drainage line 51 is connected to the outer processing chamber 43 to discharge pure water and the interior atmosphere. With the connection of the first drainage line 50, the wafer cleaning device 5 is adapted so that the supply nozzle 34 supplies APM to a surface of the wafer W again. Therefore, it is possible to reuse this processing liquid advantageously and additionally, an exhaust displacement can be reduced.
Inventors:
Mitsunori Nakamori
Hiromi Taniyama
Takanori Miyazaki
Hiromi Taniyama
Takanori Miyazaki
Application Number:
JP34378099A
Publication Date:
March 03, 2010
Filing Date:
December 02, 1999
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B08B3/02; H01L21/304; H01L21/00; H01L21/02; H01L21/306
Domestic Patent References:
| JP11168078A | ||||
| JP10340875A | ||||
| JP8323302A | ||||
| JP10074725A | ||||
| JP10289894A | ||||
| JP10070101A |
Attorney, Agent or Firm:
Koji Hagiwara
Tetsuo Kanamoto
Miaki Kametani
Tetsuo Kanamoto
Miaki Kametani