Title:
基板処理装置
Document Type and Number:
Japanese Patent JP6370084
Kind Code:
B2
Abstract:
The CMP apparatus is provided with a polishing unit 3; a cleaning unit 4; a load/unload unit for transferring substrates to the polishing unit 3 and receiving substrates from the cleaning unit 4; a wafer transporting unit; and a control section 5 for controlling the timing of loading wafers into the CMP apparatus. The control section 5 creates a time table correlating treatment ending times or scheduled treatment ending times in polishing sections, cleaning sections and transporting sections for each plurality of wafers to be loaded into the CMP apparatus and controls the timing of loading the plurality of wafers into the CMP apparatus on the basis of the time table, so that a standby state does not occur in a period from when the wafers are loaded into the CMP apparatus to when cleaning treatment is completed.
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Inventors:
Mitsunori Sugiyama
Masafumi Inoue
Masafumi Inoue
Application Number:
JP2014081012A
Publication Date:
August 08, 2018
Filing Date:
April 10, 2014
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B51/00; B24B37/04; B24B41/06; H01L21/304
Domestic Patent References:
| JP2008133286A1 | ||||
| JP2014022546A | ||||
| JP2003241818A | ||||
| JP2007103741A |
Foreign References:
| US20090035101 |
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yamazaki Kosaku
Yukio Kanegae
Koichi Kushida
Takahiko Ieari
Toru Miyamae
Yamazaki Kosaku
Yukio Kanegae
Koichi Kushida
Takahiko Ieari