Title:
基板処理装置
Document Type and Number:
Japanese Patent JP6843126
Kind Code:
B2
Abstract:
A substrate processing apparatus has a table on which a polishing surface for polishing a substrate is provided, and a discharge suction section which has a discharge port which communicates with a fluid supply source and through which a fluid is discharged to the polishing surface and a suction opening which communicates with a vacuum source and through which the fluid existing on the polishing surface is sucked.
Inventors:
Hiroyuki Shinozaki
Application Number:
JP2018513067A
Publication Date:
March 17, 2021
Filing Date:
March 14, 2017
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B53/017; B24B37/10; H01L21/304
Domestic Patent References:
| JP10329009A | ||||
| JP2007035973A | ||||
| JP2001277095A | ||||
| JP11291155A | ||||
| JP2014117776A |
Attorney, Agent or Firm:
Seiji Ohno
Kobayashi Hideyoshi
Hiroyuki Ohno
Koji Morita
Osamu Tsuda
Matsuno Chihiro
Seiichi Sakitani
Hiroshi Nomoto
Kobayashi Hideyoshi
Hiroyuki Ohno
Koji Morita
Osamu Tsuda
Matsuno Chihiro
Seiichi Sakitani
Hiroshi Nomoto