Title:
基板処理装置
Document Type and Number:
Japanese Patent JP6990980
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a substrate polishing unit 40 having a polishing pad for polishing a wafer W, and a top ring 41 for holding a wafer and pressing the wafer against the polishing pad. An elastic membrane 80 for holding a surface opposite to a polishing surface of the wafer W is attached to the top ring 41 as a consumable. The elastic membrane 80 is provided with a plurality of strain sensors 85 and 86 for measuring strain occurring in the elastic membrane 80 during polishing, and data of an amount of strain is read to a control device 15 by detection units 90 and 91. The control device 15 sets a processing condition such as a polishing recipe for the wafer W based on strain information of the elastic membrane 80 measured by the strain sensors.
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Inventors:
Namiki Keisuke
Fukushima Makoto
Fukushima Makoto
Application Number:
JP2017071573A
Publication Date:
January 12, 2022
Filing Date:
March 31, 2017
Export Citation:
Assignee:
Ebara Corporation
International Classes:
H01L21/304; B23Q15/16; B24B37/30; B24B49/10; H01L21/02
Domestic Patent References:
| JP2011194509A | ||||
| JP2008310404A | ||||
| JP2009542449A | ||||
| JP2014223684A | ||||
| JP2014011432A | ||||
| JP2015051501A | ||||
| JP2001009712A | ||||
| JP2016207862A | ||||
| JP2013052483A |
Foreign References:
| WO2000045993A1 |
Attorney, Agent or Firm:
Seiji Ohno
Hideki Kobayashi
Hiroyuki Ohno
Morita Koji
Rika Fukami
Tomohiro Matsuno
Seiichi Sakatani
Hiroshi Nomoto
Hideki Kobayashi
Hiroyuki Ohno
Morita Koji
Rika Fukami
Tomohiro Matsuno
Seiichi Sakatani
Hiroshi Nomoto