Title:
基板処理装置
Document Type and Number:
Japanese Patent JP7055658
Kind Code:
B2
Abstract:
Provided is a substrate processing apparatus for supplying a process fluid to a substrate, the apparatus comprising a nozzle tube (412) that discharges the process fluid onto the substrate, a fluid delivery tube (411) that is connected to the nozzle tube (412) and delivers process fluid to the nozzle tube (412), and a suction tube (413) that is connected to the nozzle tube (412) downstream of the fluid delivery tube (411) and suctions process fluid within the nozzle tube (412). The inner diameter of the nozzle tube (412) at least downstream of the position at which the suction tube (413) connects thereto is equal to or less than the inner diameter of the suction tube (413). As a result, the suction force for suctioning the process fluid reaches sufficiently into the nozzle tube. Accordingly, the process fluid is inhibited from remaining within the nozzle tube, making it possible to prevent dripping of the process fluid.
Inventors:
Takashi Tani
Shigenori Tanizawa
Takeshi Akiyama
Shigenori Tanizawa
Takeshi Akiyama
Application Number:
JP2018023995A
Publication Date:
April 18, 2022
Filing Date:
February 14, 2018
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304
Domestic Patent References:
| JP2017183568A | ||||
| JP2016063035A | ||||
| JP2009099599A | ||||
| JP2013172079A |
Attorney, Agent or Firm:
Takami Nishida
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