Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
基板処理方法および基板処理装置
Document Type and Number:
Japanese Patent JP6993806
Kind Code:
B2
Abstract:
A substrate processing method includes a substrate holding step of horizontally holding a substrate having a first major surface and a second major surface at an opposite side of the first major surface, a coating film forming step of supplying a coating agent to the first major surface to form a sublimating coating film which covers the first major surface, and a coating film cleaning step of cleaning a front surface of the coating film.

Inventors:
Hitoshi Nakai
Yasunori Kanamatsu
Application Number:
JP2017148111A
Publication Date:
January 14, 2022
Filing Date:
July 31, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304
Domestic Patent References:
JP2008140818A
JP2012243869A
JP2015065396A
JP2016103595A
JP2015149410A
JP2013042093A
JP2013016699A
Foreign References:
US20160099160
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office