BOARD STACKING DEVICE AND BOARD STACKING METHOD

Title:

BOARD STACKING DEVICE AND BOARD STACKING METHOD

Document Type and Number:

Japanese Patent JP2023156160

Kind Code:

A

Abstract:

To smoothly overlap two substrates while suppressing bending of the substrates when overlapping the two substrates.SOLUTION: A substrate stacking device 100 stacks two substrates S1 and S2 under an atmospheric pressure atmosphere. The substrate stacking device 100 includes a lift pin 41 that lifts and lowers while supporting the transported substrates S1 and S2, an alignment mechanism 60 that positions the substrates S1 and S2 when the lift pin 41 descends, and a suction portion 31 that suctions the upper surface of the substrate S1 supported by the lift pins 41 and receives the substrate S1 from the lift pins 41.SELECTED DRAWING: Figure 1

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Inventors:

KIKUCHI SUKEFUMI
YAMADA YOSHIHIRO
IKEDA TAKAO

Application Number:

JP2022065854A

Publication Date:

October 24, 2023

Filing Date:

April 12, 2022

Export Citation:

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Assignee:

AIMECHATEC LTD

International Classes:

H01L21/683; H01L21/02

Attorney, Agent or Firm:

Kazuya Nishi

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