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Patent Searching and Data


Title:
BOARD TYPE TEMPERATURE FUSE, AND MANUFACTURING METHOD OF BOARD TYPE TEMPERATURE FUSE
Document Type and Number:
Japanese Patent JP2008226796
Kind Code:
A
Abstract:

To provide a board type temperature fuse of an axial type which has low resistance, is stable, is excellent in fusing workability, and has high pulling strength of a lead conductor.

A pair of membrane electrodes 2, 2 are formed on one surface of an insulating substrate 1. Respective end parts of lead conductors 4 opposing in a straight line are welded to the respective membrane electrodes 2, 2. A low melting fusible alloy piece 3 is welded between tip end surfaces of both of the lead conductors 4, 4. A protective coating 6 is provided so as to cover the low melting fusible alloy piece.


Inventors:
Kaneda, Kimiro
Application Number:
JP2007000067689
Publication Date:
September 25, 2008
Filing Date:
March 16, 2007
Export Citation:
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Assignee:
UCHIHASHI ESTEC CO LTD
International Classes:
H01H37/76; C22C28/00; H01H69/02