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Title:
基板、回路基板および電池パック
Document Type and Number:
Japanese Patent JP4946742
Kind Code:
B2
Abstract:

To provide a substrate, a circuit board, and a battery pack, which prevents a metal plate and a protection circuit from short-circuiting before soldering, and inhibits malfunctions in an over voltage protection IC or the like.

Plating 7 consisting of conductive materials such as copper or the like is formed in an inside surface of an open hole 12. An island 13 is formed around an opening of the open hole 12. The island 13 is provided with a soldering island part 14 which is used as a soldered part. The soldering island part 14 consists of: a first island part 15 provided around the opening of the open hole 12; and a second island part 16 provided around the first island part 15, so as not to touch the first island part 15.

COPYRIGHT: (C)2009,JPO&INPIT


Inventors:
Yohei Funatsu
Application Number:
JP2007230666A
Publication Date:
June 06, 2012
Filing Date:
September 05, 2007
Export Citation:
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Assignee:
ソニー株式会社
International Classes:
H05K3/34; H01M2/10; H05K1/02
Domestic Patent References:
JP11214833A
JP6061630A
JP2007109465A
Attorney, Agent or Firm:
Masatomo Sugiura



 
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