PURPOSE: To make it possible to apply a prescribed amt. of a bound for adhering electronic parts on a substrate regardless of fluctuations in the liquid level of the bond in a syringe without the occurrence of cobwebbing of the bond at the time of discharging the bond from a nozzle and applying the bond on the substrate.

CONSTITUTION: A gas pressure is applied on the bond 10 in the syringe by an air supplying section 17 to discharge the bond 10 from an elastic tube 13 and to apply the bond on the substrate 22. This air supplying section 17 operates always and applies the specified gas pressure on the bond 10, thereby discharges always the prescribed amt. of the bond 10 from the elastic tube 13. Both of two clampers 15a, 15b are closed to stop the discharge of the bond 10 and, thereafter, the lower clamper 15b is opened and the elastic tube 13 is expanded, by which the bond 10 lower than the clamper 15b is sucked up and the occurrence of the cobwebbing is obviated.