Title:
BOND APPLYING DEVICE
Document Type and Number:
Japanese Patent JP3232653
Kind Code:
B2
Abstract:
PURPOSE: To provide a bond applying device by which the quantity of the bond to be applied to a substrate can be changed by selectively using plural syringes.
CONSTITUTION: Plural syringes 28 are arranged around a rotor 22 and the rotor 22 is turned by a thrning means 25 to turn the desired syringes 28 to the bond applying position, causing the syringes 28 to be selected, and at the bond applying position, the syringes 28 have an air pressure giving means 60 in common.
Inventors:
Anto Onizuka
Application Number:
JP13659292A
Publication Date:
November 26, 2001
Filing Date:
May 28, 1992
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B05C5/00; H01L21/52; H05K3/34; (IPC1-7): B05C5/00; H01L21/52; H05K3/34
Domestic Patent References:
| JP2303570A | ||||
| JP42194A | ||||
| JP6456165A | ||||
| JP6371575U |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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