Title:
BOND AND MANUFACTURE OF THE SAME
Document Type and Number:
Japanese Patent JPH0928486
Kind Code:
A
Abstract:
To provide bond and manufacture of the same with which the beauty of the grain of wood or the formative beauty of bark can be effectively utilized.
Bond A is constituted by bonding parallelly arranged wood 1 and 2 while using a low fusing point material 3 which has a fusing point almost equal with or lower than the burning temperature of wood and is solidified at ordinary temperature. Concerning the manufacture, plural pieces, of wood 1 and 2 are parallelly arranged at an interval, the low melting point material 3 is melted, the interval is filled with it, afterwards, the material is cooled and the pieces 1 and 2 are joined.
Inventors:
HIRAI MASAO
Application Number:
JP18535595A
Publication Date:
February 04, 1997
Filing Date:
July 21, 1995
Export Citation:
Assignee:
HIRAI MASAO
YOKOYAMA TAKESHI
YOKOYAMA TAKESHI
International Classes:
A47B96/20; (IPC1-7): A47B96/20
Attorney, Agent or Firm:
Shukichi Nakagawa (1 person outside)
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