Title:
BONDED ASSEMBLY AND BONDING METHOD
Document Type and Number:
Japanese Patent JP2019015225
Kind Code:
A
Abstract:
To reduce the number of components and to easily bond two members even without penetrating and projecting a boss of a resin.SOLUTION: A bonding method is a method for bonding a first member to a second member. The first member consists of a thermoplastic resin. The first and second members include first and second outer surfaces which should be bonded with each other and are exposed outsides, and the first member includes a first inner surface. The bonding method includes the steps of: forming a cylindrical part which is exposed from the second outer surface and includes a non-flat part on an inner peripheral surface, in the second member; forming a protrusion protruding from the first outer surface in the first member; inserting the protrusion of the first member into the cylindrical part of the second member; vibrating an ultrasonic horn in a state where the ultrasonic horn is brought into contact with the first inner surface of the first member, ultrasonic-depositing the protrusion of the first member to the cylindrical part of the second member, and adhering a portion of the protrusion to the non-flat part.SELECTED DRAWING: Figure 6
Inventors:
TAJIMA SHINYA
HASHIMOTO TOMOYUKI
HASHIMOTO TOMOYUKI
Application Number:
JP2017132751A
Publication Date:
January 31, 2019
Filing Date:
July 06, 2017
Export Citation:
Assignee:
MITSUMI ELECTRIC CO LTD
International Classes:
F04B45/047
Attorney, Agent or Firm:
Kenho Ikeda
Takashi Sasaki
Takashi Sasaki