Title:
BONDED BODY, BONDING METHOD WITH BONDED BODY AND REPAIRING METHOD WITH BONDED BODY
Document Type and Number:
Japanese Patent JP2004285188
Kind Code:
A
Abstract:
To provide a bonded body that easily prevents a water leak.
The bonded body 20 is obtained by mixing at least d-limonene and polystyrene foam. The bonded body 20 is formed in at least any one of a penetrable liquid bonded body, an elastic gel- and a clay-like bonded body by changing the mixing ratio of d-limonene to the polystyrene foam.
Inventors:
HAMASHITA HIROFUMI
Application Number:
JP2003078500A
Publication Date:
October 14, 2004
Filing Date:
March 20, 2003
Export Citation:
Assignee:
HAMASHITA HIROFUMI
HAMASHITA SHIGEMI
HAMASHITA SHIGEMI
International Classes:
E02D29/12; C09J5/00; C09J125/04; C09K3/10; E03F5/10; (IPC1-7): C09J125/04; C09J5/00; C09K3/10; E02D29/12; E03F5/10
Attorney, Agent or Firm:
Yasuo Ishikawa
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