Title:
貼り合わせ封書
Document Type and Number:
Japanese Patent JP3588764
Kind Code:
B2
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Inventors:
Tadanao Ashiya
Application Number:
JP8718596A
Publication Date:
November 17, 2004
Filing Date:
March 14, 1996
Export Citation:
Assignee:
Tadanao Ashiya
International Classes:
B42D15/02; B42D15/08; B65D27/04; (IPC1-7): B65D27/04; B42D15/02; B42D15/08
Domestic Patent References:
| JP6151343U | ||||
| JP3014640U |
Attorney, Agent or Firm:
Takami Teshima