Title:
導電材料の接合体
Document Type and Number:
Japanese Patent JP5786866
Kind Code:
B2
Abstract:
A bonded body of electrically conductive materials including a bonding interface structure in which paired bonded members (10, 20) made respectively of electrically conductive materials are surface-bonded to each other. The bonding interface structure has at least: a diffusion bonding region in which the electrically conductive materials are mutually diffused; and a plastic flow bonding region which has a pressure bonded and recrystallized structure through plastic flow of the electrically conductive materials.
Inventors:
Shigeyuki Nakagawa
Toshikazu Nanbu
Chika Yamamoto
Tohru Fukami
Toshikazu Nanbu
Chika Yamamoto
Tohru Fukami
Application Number:
JP2012548740A
Publication Date:
September 30, 2015
Filing Date:
December 05, 2011
Export Citation:
Assignee:
Nissan Motor Co., Ltd
International Classes:
B23K20/00
Domestic Patent References:
| JP2008137047A | 2008-06-19 | |||
| JP2010184260A | 2010-08-26 | |||
| JP2008142739A | 2008-06-26 | |||
| JP2007118059A | 2007-05-17 | |||
| JP2004174546A | 2004-06-24 | |||
| JPH09239566A | 1997-09-16 | |||
| JPH07116868A | 1995-05-09 | |||
| JP2000102885A | 2000-04-11 | |||
| JP2009000700A | 2009-01-08 | |||
| JP2000312981A | 2000-11-14 |
Attorney, Agent or Firm:
Hatta International Patent Corporation