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Title:
BONDED MOLDING OF OLEFIN POLYMER MIXTURE
Document Type and Number:
Japanese Patent JPS58185633
Kind Code:
A
Abstract:

PURPOSE: A bonded product of a high bonding strength, prepared by adding a specified unsaturated organic compound and an organic peroxide to an olefin polymer, molding the mixture, coating the surface of the molding with an isocyanato group-containing adhesive and bonding the molding to an adhered.

CONSTITUTION: To 100pts.wt. olefin are added 0.1W50pts.wt. organic compound having at least one unsaturated bond and a hydroxyl group in the molecule (e.g., 2-hydroxyethyl acrylate, 2-hydroxypropyl methacrylate), and 0.01W20pts.wt. organic peroxide (e.g., benzoyl peroxide, dicumyl peroxide), and the resulting mixture is molded. The surface of the molding is coated with an isocyanato group-containing adhesive (e.g., solvent type urethane adhesive, water-based vinylurethane adhesive), and the molding is bonded to an adherend.


Inventors:
NAGAI YOUZOU
SEKIGUCHI SABUROU
TAKAISHI MINORU
Application Number:
JP6860982A
Publication Date:
October 29, 1983
Filing Date:
April 26, 1982
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
C08L23/00; B32B27/32; C08J5/12; C08K5/04; C08K5/05; C08K5/10; C08K5/14; C08L7/00; C08L21/00; C08L23/02; C08L51/00; C08L51/02; C08L51/06; C08L53/00; C08L77/00; C08L101/00; C09J5/00; (IPC1-7): B29C27/10; C08K5/05; C08K5/14; C08L23/02; C08L53/00; C09J5/00
Attorney, Agent or Firm:
Minoru Terada



 
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