Title:
BONDED SUBSTRATE
Document Type and Number:
Japanese Patent JP2023008681
Kind Code:
A
Abstract:
To obtain a bonded substrate capable of suppressing manufacturing cost and improving heat transfer performance.SOLUTION: A bonded substrate 10 includes a wiring board 20 having a through hole 21, and a metal plate 40 bonded to one surface of the wiring board 20 via an adhesive layer 30. The metal plate 40 has a concave portion 42 formed in a surface facing the through hole 21 of the wiring board 20, and when the metal plate 40 is bonded to one side surface of the wiring board 20, a part of the material of the adhesive layer 30 enters a recess 42 of the metal plate 40 such that the material of the adhesive layer 30 does not protrude to the other surface of the wiring board 20 through the through hole 21.SELECTED DRAWING: Figure 3
Inventors:
YANAGIDA SOJI
Application Number:
JP2021112419A
Publication Date:
January 19, 2023
Filing Date:
July 06, 2021
Export Citation:
Assignee:
SHINDENGEN ELECTRIC MFG
International Classes:
H05K1/02
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office