Title:
BONDING FOR ALUMINUM NITRIDE CERAMIC
Document Type and Number:
Japanese Patent JPH11171659
Kind Code:
A
Abstract:
To provide a method for bonding a base material composed of an aluminum nitride ceramic to another member in a lower temperature range than a conventional method.
A precursor compound of aluminum nitride containing at least an aluminum-nitrogen bond is thermally decomposed in a state of being laid between a base material composed of an aluminum nitride ceramic and another member to bond the base material to the member. The precursor compound is, for example, a polyalkyliminoalane.
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Inventors:
KOBAYASHI HIROMICHI
WATANABE KEIICHIRO
WATANABE KEIICHIRO
Application Number:
JP34505397A
Publication Date:
June 29, 1999
Filing Date:
December 15, 1997
Export Citation:
Assignee:
NGK INSULATORS LTD
International Classes:
C04B37/00; (IPC1-7): C04B37/00
Attorney, Agent or Firm:
Akihide Sugimura (8 outside)