PURPOSE: To increase a bonding strength by a method wherein, in order to form a conductive connection by bonding a conductive member, to be connected, by using a conductive bonding material such as a solder, a conductive adhesive or the like, a small through hole is made in at least a bonding part on one side of the conductive member.

CONSTITUTION: In a flexible wiring connecting member 1, many a multiplicity of wiring 12 composed of a copper foil or the like as conductive members are provided on one face of a flexible base material 11 composed of a synthetic-resin film such as a polyimide resin or the like. On a control circuit board 2, a printed wiring board on which wiring 22 as a conductive member is provided on the surface of a base material 21 composed of a comparatively hard synthetic resin or the like is used. In the connecting part of the connecting member 1 to the control circuit board, only the wiring 12 exists by cutting the base material 11, and small through holes 12a are made in the wiring 12. In the base material 11 and on the circuit board 2, individual end parts of the wiring 22 are bonded by using a solder 3; and one part of the solder 3 flows into the small through holes 12a made in the wiring 12, and is solidified in a state that it is swollen on a face opposite to a bonding face to the wiring 22.