Title:
BONDING CAPILLARY
Document Type and Number:
Japanese Patent JPS55138850
Kind Code:
A
Abstract:
PURPOSE:To reduce the outer diameter of a solderless ball bonded portion at the end of a capillary body, to prevent an accident of contacting with other electrode and to improve the quality thereof and productivity of a bonding capillary by reducing the diameter of the solderless ball bonded portion smaller than that of the ball at the end of a wire. CONSTITUTION:A hole 32 for passing an AU wire is perforated at a capillarly body 31 in central direction, and a tapered corner 33 is formed at the end of the hole 32 of the capillary body 31. Further, the tapered angle theta on the outer periphery of the capillary body 31 is formed acutely so that an Au ball 41 may not be solderlessly bonded on the outer periphery. The Au wire 42 is solderlessly bonded through the ball 41 onto a semiconductor pellet 43. In this case, the diameter T at the end of the capillary is formed smaller than that OD of the ball 41. Thus, the ball 41 is upwardly escaped without being solderlessly bonded at the end of the capillary on the outer peripheral side thereof to form an annular projection 44 therearound.
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Inventors:
HASHIMOTO TAKESHI
OONO ATSUSHI
KATOU MISAO
MORISHITA SHIYOUJI
OONO ATSUSHI
KATOU MISAO
MORISHITA SHIYOUJI
Application Number:
JP4681879A
Publication Date:
October 30, 1980
Filing Date:
April 17, 1979
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
B23K20/00; H01L21/60; H01L21/603; (IPC1-7): B23K20/02