Title:
BONDING DEVICE, BONDING SYSTEM AND BONDING METHOD
Document Type and Number:
Japanese Patent JP2017112322
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce distortion occurring in a substrate after bonding.SOLUTION: A bonding device includes a first holding part, a second holding part, a pushing part, and a structure for canceling the difference of deformation amount incident to the anisotropy of Young's modulus. The first holding part suction holds the first substrate, out of two substrates including the substrate having anisotropy in Young's modulus, to the lower surface. The second holding part is provided below the first holding part, and suction holds the second substrate, out of the two substrates, to the upper surface. The pushing part presses the central part of the first substrate from above and brings into contact with the second substrate. The structure for canceling the difference of deformation amount incident to the anisotropy of Young's modulus cancels the difference of deformation amount incident to the anisotropy of Young's modulus, out of the difference of deformation amount of the first and second substrates caused by pressing of the first substrate by the pushing part.SELECTED DRAWING: Figure 16
Inventors:
FURUYA HAJIME
SUGIHARA SHINTARO
SUGIHARA SHINTARO
Application Number:
JP2015247713A
Publication Date:
June 22, 2017
Filing Date:
December 18, 2015
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/02; B23K20/00
Domestic Patent References:
| JP2015515111A | 2015-05-21 | |||
| JP2013149725A | 2013-08-01 |
Attorney, Agent or Firm:
Sakai International Patent Office