Title:
BONDING DEVICE
Document Type and Number:
Japanese Patent JP2020066809
Kind Code:
A
Abstract:
To provide a bonding device which can simplify sealing work for preventing a discharge port of a nozzle from coming into contact with the outside air.SOLUTION: A bonding device includes a nozzle 11, a conveyance part, a nozzle lever, a heating part, a supply part, a discharge conveyance control part, and a sealing member. The heating part heats an adhesive agent to a temperature higher than a predetermined melting temperature. The supply part supplies the heated adhesive agent to the nozzle 11. The nozzle lever supports the nozzle 11 so as to change between a bonding position in which the nozzle 11 is arranged further on the conveyance direction upstream side than the conveyance part and between a first sheet and a second sheet in the vertical direction, and a retreat position in which the vertical direction of the nozzle 11 is further upward than the bonding position. The sealing member 60 has heat resistance with respect to the temperature higher than the melting temperature of the adhesive agent, has a resin member 61 for closing a discharge port, and can be attached to/detached from the nozzle 11 arranged in the retreat position.SELECTED DRAWING: Figure 5
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Inventors:
IWAKOSHI HIROYASU
TADA SATORU
TADA SATORU
Application Number:
JP2018198632A
Publication Date:
April 30, 2020
Filing Date:
October 22, 2018
Export Citation:
Assignee:
BROTHER IND LTD
International Classes:
D06H5/00; B05C5/00
Attorney, Agent or Firm:
Hisashi Yamamoto
Sayuri Fujita
Sayuri Fujita