Title:
BONDING DEVICE
Document Type and Number:
Japanese Patent JP2839215
Kind Code:
B2
Abstract:
PURPOSE: To provide a bonding device which replaces a bonding tool easily and promptly to conformity with changes in types of components to be bonded and prevents the generation of artificial errors accompanied by type changes.
CONSTITUTION: A bonding plate 2, which provided adhesion to a component 1 to be bonded in cooperation with a bonding tool, is held with a diaphragm 5 and adapted to play freely. Therefore, this construction allows the bonded components to be mounted in conformity with the pressure side of the bonding tool and eliminates the need for slanting adjustment work for the bonding tool.
Inventors:
TAKANO TADASHI
Application Number:
JP25021791A
Publication Date:
December 16, 1998
Filing Date:
September 04, 1991
Export Citation:
Assignee:
KAIJOO KK
International Classes:
H01L21/60; B23K3/08; H01L21/52; (IPC1-7): H01L21/60; H01L21/52
Domestic Patent References:
| JP397239A | ||||
| JP63229727A | ||||
| JP1125852A | ||||
| JP60211854A |
Attorney, Agent or Firm:
Shoji Hagiri