Title:
BONDING DEVICE
Document Type and Number:
Japanese Patent JP3546376
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To perform the movement of a chip and a substrate by one delivery means, to suppress the production cost of a bonding device, and at the same time to contrive a miniaturization of the bonding device.
SOLUTION: The following means are adopted as means for a bonding device. First, the means is formed as a device of a structure that the device is provided with a relay stage for a chip, a bonding head and a substrate stage, and the bonding head and the substrate stage are moved relatively to each other to bond the chip to a substrate. Secondly, the means is formed as a device of a structure that a delivery means provided with a holding part for holding the chip and the substrate is movably provided relatively to the relay stage and the substrate stage. Thirdly, the means is formed as a device of a structure that the chip held by the holding part is placed on the relay stage, and at the same time the substrate held by the holding part is placed on the substrate stage, or the substrate placed on the substrate stage is held by the holding part.
Inventors:
Tetsuo Kitaguchi
Application Number:
JP2000238960A
Publication Date:
July 28, 2004
Filing Date:
August 07, 2000
Export Citation:
Assignee:
Shibuya Industry Co., Ltd.
International Classes:
H01L21/52; H01L21/00; H01L21/50; (IPC1-7): H01L21/52; H01L21/50
Attorney, Agent or Firm:
Katsushi Nishina