Title:
Bonding device
Document Type and Number:
Japanese Patent JP6064173
Kind Code:
B2
Abstract:
A bonding apparatus includes: a backup unit including a light-transmissive transmission member having a support surface which supports at least a bonding region of a light-transmissive board from below; a pressure-bonding unit which presses an electronic component placed on the bonding region via a photo-curable adhesive agent; and a light irradiation unit which irradiates the supporting surface with light which promotes hardening of the adhesive agent. The electronic component is bonded to the board by pressing the electronic component mounted on a top surface of the adhesive agent in a state in which light from the light irradiation unit is incident upon the adhesive agent through the supporting surface. The bonding apparatus further includes a light distribution measuring unit which measures a distribution of light from the light irradiation portion in the supporting surface.
Inventors:
Yasutaka Tsuboi
Akira Yamada
Toshihiko Tsujikawa
Akira Yamada
Toshihiko Tsujikawa
Application Number:
JP2013211543A
Publication Date:
January 25, 2017
Filing Date:
October 09, 2013
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H01L21/60
Domestic Patent References:
| JP969543A | ||||
| JP845989A | ||||
| JP7113610B2 |
Attorney, Agent or Firm:
Kenji Kamada
Hiroo Maeda
Hiroo Maeda