Title:
Bonding device
Document Type and Number:
Japanese Patent JP6217902
Kind Code:
B2
Abstract:
A boding device includes a light guiding part that guides laser beam oscillated from a laser oscillator, a bonding head that heats a chip with the laser beam, and a bonding head moving part that moves the bonding head between a supply position and a bonding position. The laser oscillator is separated from the bonding head. The light guiding part includes an irradiation barrel that is provided in the vicinity of the bonding position and, a shutter part that is provided in the irradiation barrel, and a light receiving part that is provided in the bonding head and guides the laser beam to the chip. When the bonding head moving part moves the bonding head to the bonding position, the shutter part is opened so that the laser beam from the irradiation barrel is guided to the bonding head through the light receiving part.
Inventors:
Hiroyuki Anji
Application Number:
JP2013116133A
Publication Date:
October 25, 2017
Filing Date:
May 31, 2013
Export Citation:
Assignee:
Shibuya Industry Co., Ltd.
International Classes:
H01L21/60; B23K26/00
Domestic Patent References:
| JP10335806A | ||||
| JP2009182162A | ||||
| JP2013235907A |
Foreign References:
| WO2012102138A1 |
Attorney, Agent or Firm:
Shinichiro Kanzaki
Makoto Kanzaki
Makoto Kanzaki