Title:
BONDING DEVICE
Document Type and Number:
Japanese Patent JPS6098633
Kind Code:
A
Abstract:
PURPOSE:To simplify structure while enabling accurate bonding by forming a pocket for positioning a sample to a stage and mounting a member, which can position and fix the sample together with the stage, to the upper section of the stage. CONSTITUTION:A leadless chip carrier 21 carried to a pocket 22 in a stage 20 is moved and positioned to a smaple placing surface 23 while being fitted to a tape 24. A cam 25 is turned, and a transmission shaft 27 is moved vertically by the action of the restoring force of a spring 26. The upper section of the leadless chip carrier 21 is brought into contact with a pushing body 28. A bonding arm 34 and a clamping arm 33 are moved vertically, and an Al wire 32 is bonded with the leadless chip carrier 21. Bonding is completed, the cam 25 is turned against the stress of the spring 26, the stage 20 is moved downward through the transmission shaft 27, and the leadless chip carrier 21 is separated from the pushing body 28.
Inventors:
OKAMOTO MICHIO
Application Number:
JP20481283A
Publication Date:
June 01, 1985
Filing Date:
November 02, 1983
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Akio Takahashi
Previous Patent: The liquid crystallinity compound, liquid crystal constituent, and liquid crystal display element wh...
Next Patent: JPS6098634
Next Patent: JPS6098634