Title:
接合装置、接合システムおよび接合方法
Document Type and Number:
Japanese Patent JP7341348
Kind Code:
B2
Abstract:
A bonding apparatus includes a first holder, a second holder, a moving unit, a housing, an interferometer, a first gas supply and a second gas supply. The first holder is configured to attract and hold a first substrate. The second holder is configured to attract and hold a second substrate. The moving unit is configured to move a first one of the first holder and the second holder in a horizontal direction with respect to a second one thereof. The interferometer is configured to radiate light to the first one or an object moved along with the first one to measure a horizontal distance thereto. The first gas supply is configured to supply a clean first gas to an inside of the housing. The second gas supply is configured to supply a second gas to a space between the interferometer and the first one or the object.
Inventors:
Hisashi Inamasu
Tetsuya Maki
Tetsuya Maki
Application Number:
JP2022536265A
Publication Date:
September 08, 2023
Filing Date:
July 05, 2021
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/02
Domestic Patent References:
| JP201518926A | ||||
| JP201149318A |
Foreign References:
| WO2018088094A1 | ||||
| WO2014064944A1 |
Attorney, Agent or Firm:
Sakai International Patent Office