Title:
BONDING GOLD ALLOY THIN WIRE
Document Type and Number:
Japanese Patent JPH06145842
Kind Code:
A
Abstract:
PURPOSE: To provide a gold bonding wire increased in breaking strength and with the loop capable of being made higher than the conventional alloy wires.
CONSTITUTION: (1) A gold alloy thin wire contains, by weight, 0.05-0.2ppm of boron, 1-20ppm of beryllium and the balance high-purity gold (≥99.995% purity) with inevitable impurities. (2) A bonding gold alloy thin wire contains the component (1) and 1-15ppm of one or ≥2 kinds among calcium. yttrium and serium, and (3) a bonding gold alloy thin wire contains the component (2), 2-50ppm of indium and the balance gold with inevitable impurities. Consequently, the same loop height and bonding strength as before can be secured.
Inventors:
KITAMURA OSAMU
Application Number:
JP29342992A
Publication Date:
May 27, 1994
Filing Date:
October 30, 1992
Export Citation:
Assignee:
NIPPON STEEL CORP
International Classes:
B23K20/00; C22C5/02; H01B1/02; H01L21/60; (IPC1-7): C22C5/02; B23K20/00; H01B1/02; H01L21/60
Attorney, Agent or Firm:
Hiroaki Tamura (1 outside)
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