Title:
BONDING INSPECTION METHOD AND DEVICE
Document Type and Number:
Japanese Patent JP3164073
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To inspect the first and second sides of a wire by judging whether wiring bonding to a pad and an IC chip is appropriate or not based on the number and position of ball-shaped parts and the number and size of crescents.
SOLUTION: First, an island and bonding pad part are illuminated with a lighting device 21, and an image is picked up by a camera 3 and its data is fetched into an image input circuit 4 (image data 1). Then, the images of six bonding wires are similarly picked up and their data is fetched into the circuit 4 (image data 2). An image data 1 binarized, and a pad position is corrected by a pad detection circuit 7 and is inputted to an AND operation circuit 9. The image data 2 is also binarized and is inputted to the AND operation circuit 9. In this case, a wire part is excluded for obtaining the image data of only crescents, and the number and area of the crescents at a second side and the number and area of balls at the first side are measured by a measurement circuit 10. Then, each measurement result is inputted to a judgment circuit 11 for judging conformity.
Inventors:
Yasushi Tomita
Application Number:
JP22692998A
Publication Date:
May 08, 2001
Filing Date:
August 11, 1998
Export Citation:
Assignee:
NEC
International Classes:
G01N21/88; G01N21/956; H01L21/60; H01L21/66; (IPC1-7): G01N21/956
Domestic Patent References:
| JP763528A | ||||
| JP7240451A | ||||
| JP9232384A |
Attorney, Agent or Firm:
Johei Yamashita